The Analysis Center is located next to Rapidus’ Innovative Integration for Manufacturing (IIM-1) advanced semiconductor foundry in Chitose, Hokkaido. The facility will carry out a range of evaluations essential to the development of advanced logic chips, including physical, environmental and chemical analysis, electrical characterisation and reliability testing.
Rapidus Chiplet Solutions, which will focus on post-production research and development for advanced packaging technologies, began setting up operations in October 2024 at Seiko Epson Corporation’s Chitose plant, close to the IIM-1 site. After the completion of its cleanroom facilities, the company started installing manufacturing equipment in April 2025.
RCS has been operating on a limited basis, including the production of a prototype 600mm square redistribution layer (RDL) interposer panel, and has now moved to full-scale operations.
An opening ceremony to mark the launch of both facilities was held on 11 April. Attendees included Japan’s Minister of Economy, Trade and Industry Ryosei Akazawa, Hokkaido Governor Naomichi Suzuki and Chitose Mayor Ryuichi Yokota. Members of the National Diet representing Hokkaido also took part in a ribbon-cutting ceremony following official remarks.
With the addition of the Analysis Center and the start of full operations at RCS, Rapidus said it aims to further enhance its research and development capabilities and continue preparations for the mass production of advanced semiconductors in the second half of the 2027 financial year.
AloJapan.com